TDV Microcut Saw & Refills
TDV Microcut is a hack saw frame designed for the removal excesses of composites, adhesives, cements and amalgams from the proximal area. It is also indicated for Inlay and Onlay, laminated vaneers and stripping in orthodontic procedures.
Features and Benefits:
- Device developed to adapt special components:
- Saw Blade removes surplus material without damaging the contact point and is only 0.05mm thick
- Diamond Strip allows you to perform stripping in orthodontic procedures and is only 0.01mm thick
- Easy and Safe handling
- All components are autoclavable